Microsoft has designed a new method of cooling data centers using liquid coolant rather than cold plates. The liquid coolant moves in small grooves in the silicon die, allowing heat to be transferred efficiently compared to cold plates, which don't directly touch the silicon die. Specifically, the grooves mimic the branching of leaf veins or butterfly wings to distribute the liquid coolant. As a result, Microsoft is hopeful that microfluidics will greatly improve AI data centers and be applied to other technology.